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54 bytes added ,  19:15, 2 November 2012
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We have gotten a price quote from a professional lab on the deal (removal, decap, delayer, SEM imaging) and it came out to $400 per layer of the chip, which they estimate will come to "about $2000 total". Plus the cost of the 3DS we will be donating for the hardware sample(s).
 
We have gotten a price quote from a professional lab on the deal (removal, decap, delayer, SEM imaging) and it came out to $400 per layer of the chip, which they estimate will come to "about $2000 total". Plus the cost of the 3DS we will be donating for the hardware sample(s).
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The numbers of layers is approximate because they likely don't know how many layers are in the SoC until they actually decap it. For now we're trying to reach their initial quote of $2000 USD and send in the 3DS to get it started. Later on we can still decide to have the remaining layers imaged.
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The numbers of layers is approximate because they likely don't know how many layers are in the SoC until they actually decap it. In the worst case we estimate between 8 or 10 layers. For now we're trying to reach their initial quote of $2000 USD and send in the 3DS to get it started. Later on we can still decide to have the remaining layers imaged.
     
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