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This page lists and describes the hardware found inside the Nintendo 3DS. Many of these parts are proprietary and are expanded upon here or in other pages.
== Specifications ==
== Specifications ==
== FCRAM ==
== FCRAM ==
There is one FCRAM(Fast Cycle RAM) in the 3DS.
There is one FCRAM (Fast Cycle RAM) IC in the 3DS, produced by Fujitsu and branded as MB82M8080-07L. The Fujitsu MB82M8080-07L chip internally contains 2 dies, where each die is branded MB81EDS516545 and MB82DBS08645.
The Fujitsu MB82M8080-07L chip internally contains 2 dies, where each die is branded MB81EDS516545 and MB82DBS08645. The MB81EDS516545 die is a CMOS Fast Cycle Random Access Memory (FCRAM*) with Low Power Double Data Rate (LPDDR) SDRAM Interface containing 512MBit storage accessible in a 64-bit format.
The MB81EDS516545 die is a CMOS Fast Cycle Random Access Memory (FCRAM*) with Low Power Double Data Rate (LPDDR) SDRAM Interface containing 512MBit storage accessible in a 64-bit format. The MB81EDS516545 is suited for consumer applications requiring high data bandwidth with low power consumption.
MB81EDS516545 is suited for consumer application requiring high data band width with low power consumption.
== Images ==
== Images ==