Hardware

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This page lists and describes the hardware found inside the Nintendo 3DS. Many of these parts are proprietary and are expanded upon here or in other pages.

Specifications

Type	Name	Datasheet	Source
SoC	Nintendo 1048 0H (Custom): CPU, GPU, VRAM & DSP all on one chip.	N/A	N/A
Processor Core	ARM11 MPCore 2x 268MHz & 2x VFP Co-Processor	[1]	[11]
GPU	DMP PICA 268MHz	N/A	[11]
DSP	134Mhz. 24ch 32728Hz sampling rates.	N/A	[11]
VRAM	6 MB within SoC. Independent of system memory (FCRAM).	N/A	[11]
FCRAM	2x64MB Fujitsu MB82M8080-07L	[2][3][4]	[5]
Storage	Toshiba THGBM2G3P1FBAI8 1GB NAND Flash	N/A	N/A
Power Management	Texas Instruments PAIC3010B 0AA37DW	N/A	FCC filing
Gyroscope	Invensense ITG-3270 MEMS Gyroscope	[5]	N/A
Accelerometer	ST Micro 2048 33DH X1MAQ Accelerometer Model LIS331DH	[6]	N/A
Wifi	802.11b/g Atheros AR6014	[7]	N/A
Infrared IC	NXP infrared IC, "S750 0803 TSD031C"	N/A	[10]
Auxiliary Microcontroller	UC CTR, custom Nintendo microcontroller	N/A	N/A

[11] Official Documentation

[5],[10] According to iFixit.com (source):

Datasheet for memory is for a chip in the same series, it has less memory than the one inside the 3DS (128mbits vs 512mbits).

There is a trove of data on the FCC website at [8].

FCRAM

There is one FCRAM (Fast Cycle RAM) IC in the 3DS, produced by Fujitsu and branded as MB82M8080-07L. The Fujitsu MB82M8080-07L chip internally contains 2 dies, where each die is branded MB81EDS516545 and MB82DBS08645.

The MB81EDS516545 die is a CMOS Fast Cycle Random Access Memory (FCRAM*) with Low Power Double Data Rate (LPDDR) SDRAM Interface containing 512MBit storage accessible in a 64-bit format. The MB81EDS516545 is suited for consumer applications requiring high data bandwidth with low power consumption.