Difference between revisions of "Hardware"

Revision as of 18:06, 8 August 2011

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According to iFixit.com (source):

Type	Name	Datasheet	Source
SoC	Nintendo 1048 0H (Custom): CPU, GPU & DSP all on one chip.	N/A	N/A
Processor Core	ARM11 Multiprocessor Core 2x 268 MHz	N/A	[1]
GPU	Digital Media Professionals Pica 268MHz	N/A	[2]
FCRAM	2x64MB Fujitsu MB82M8080-07L	[3]	[4]
Storage	Toshiba THGBM2G3P1FBAI8 1GB NAND Flash	N/A	N/A
Power Management	Texas Instruments PAIC3010B 0AA37DW	N/A	FCC filing
Gyroscope	Invensense ITG-3270 MEMS Gyroscope	[5]	--
Accelerometer	ST Micro 2048 33DH X1MAQ Accelerometer Model LIS331DH	[6]	--
Wifi	802.11b/g Atheros AR6014	[7]	N/A
Infrared IC	NXP infrared IC, "S750 0803 TSD031C"	N/A	[8]
Auxiliary Microcontroller	UC CTR, custom Nintendo microcontroller	N/A	N/A

Datasheet for memory is for a chip in the same series, it has less memory than the one inside the 3DS (128mbits vs 512mbits).

There is a trove of data on the FCC website at [9].

NAND dumping has been successful, but the image is encrypted.

SDIO interface is colored red:

This is the interface for the 'NEW' WiFi module (based on Atheros AR6002) first included in DSi.

The proprietary and by now ancient DS-mode WiFi is colored yellow, pins are unknown.

I2C eeprom is colored blue:

SPI Flash is colored purple:

Monitors HOME button, WiFi switch, 3D slider, volume control slider. Controls LEDs, various power supplies.

@@ Line 25: / Line 25: @@
 | Wifi || 802.11b/g Atheros AR6014 || [http://www.db.pokestation.net/3DS/Wi-Fi%20module%20pinouts.pdf] || N/A
 |-
-| Infrared IC || NXP infrared IC, "S750 0803 TSD031C" - used for communication with charging cradle. || N/A || [http://www.ifixit.com/Teardown/Nintendo-3DS-Teardown/5029/2#s22675]
+| Infrared IC || NXP infrared IC, "S750 0803 TSD031C" || N/A || [http://www.ifixit.com/Teardown/Nintendo-3DS-Teardown/5029/2#s22675]
 |-
 | Auxiliary Microcontroller || UC CTR, custom Nintendo microcontroller || N/A || N/A